Plastic Encapsulated (PDIP, PPGA, PLCC, SOIC, SSOP)
Family / Package
Leads
   
PDIP, .300" 8/14/16/18/20/24
PDIP, .400" 22
PDIP, .600" 24/28/40/48
PDIP, .900" 64
Plastic Flat Pack 24
Plastic Leaded Chip Carrier (PLCC) 20/28/44/52/68/84
Low Stand Off (LSOP) NOTE: Exposed Die Pad on LSOP Packages are available & optional 8/16
Small Outline (SOIC), .150’ 8/14/16
Small Outline (SOIC), .300" 16/20/28
Small Outline J-Lead (SOJ), .400" 32
Shrink Small Outline (SSOP),.150” 16/20/24/28
Shrink Small Outline (SSOP),.300” 28/48/56
Plastic Pin Grid Array (PPGA) Up to 672 Pins
Plastic Micro-X 4
   

 

ISO9001:2008

ISO13485::2003