Hermetic

Family / Package
Leads
   
CerDip, .300" 8/14/16/18/20/24/28
CerDIP, .400" 22/24
CerDIP, .600" 24/28/32/40/48
Ceramic side / top / bottom brazed 8 thru 64
Chip carrier Up to 370 Leads
Chip On Board (COB), Chip On Flex(COF)  
Metal can (Header) TO-3, -5, -8, -18, -39, -46, -52  
Pin Grid Array (PGA), Ceramic  
Cerpack, Cerquad  
Surface mount, ceramic (SMT)  
Hybrid (Incl. Thick Film Print on Substrate)  
Power devices (Up to .020" Alum Wire)  
Microwave devices ( Various designs )  

 

ISO9001:2008

ISO13485::2003