Pantronix Component Division

 

Founded in 1974, the Pantronix Component Division quickly became a leader in Plastic, Hi-Rel, Photonics, and Commercial Custom Packaging and Testing Services for the Semiconductor Industry. Pantronix has assembled and tested more ICs onshore in the past quarter than any other independent packaging foundry.

The Component Division directly serves the Aerospace, Medical, Communications, Fiber Optics, Wireless, and Computer Applications. With the technical expertise to assemble and test a wide variety of semiconductor packages and modules, Pantronix can provide competitive pricing and cycle time in all phases of production required by the semiconductor markets.

In the world of semiconductor device assembly and test, Pantronix can handle virtually any task of size and complexity.

 

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